Zygo will be displaying its Nexview3D optical profiler with Coherence Scanning Interferometry (CSI) technology with enhanced Mx surface metrology software and advanced thin film metrology and analysis.

Based on Zygo’s Model Based Analysis (MBA), this through-the-lens technology enables quantitative areal topography of thin films (≥50nm thick) without contact or preparation. The profile is precise, flexible, and offers high throughput for optimal process control.

MBA gives simultaneous measurement of full area film thickness and topography, substrate topography and thickness variation maps, as well as true corrected surface maps of dissimilar materials.