The Rofin-Basel LASAG PWS Mini desktop workstation incorporates a compact high accuracy design whilst maintaining great flexibility
Raylase has expanded its portfolio with digital scan heads for high-end applications. The heads enable highly accurate marking, different process optimised tunings, improved dynamics and numerous diagnostic options
Foba has announced the Foba M-Series, a new suite of advanced laser marking workstations
Laser Machining Technologies has unveiled its Diamond Series micro-machining laser
Rofin's EasyJewel product, for jewellery marking and deep engraving, now features an enhanced mode to achieve large engravings with immaculate surfaces and seamless circumferential designs
Rofin's Scanner Welding System (SWS) is a fast beam deflection system used for robot-guided multi-spot welding and developed for use in conjunction with Rofin's fibre laser series, which is available with output powers of up to 4,000W
Trumpf has announced its TruLaser Tube 7000, a machine that can process tubes with a rectangular, round or oval cross-section
The LPKF LQ-Smart is a two-piece laser welding system with a small workbench footprint
Electrox has introduced its galvo-based scanning system combination with the new Raptor and D-Box solution
Bielomatik has announced that its K3642 laser integration module has been optimised for class 7 clean rooms
Keely Portway looks at the latest advances in diamond turning, including new properties and functions for optics
Credit: Parilov/Shutterstock.com
Joerg Volpp and Adrien da Silva, at the Luleå University of Technology, investigate beam shaping possibilities for high-power processing, co-authored by Alexander Laskin, from Adloptica
Carlos Lee, Epic’s director general, talks to Maria Chiara Ubaldi, co-founder and chief executive of Milan-based CareGlance
Image: Universal Quantum
Gemma Church details Universal Quantum’s work building a million-qubit quantum computer and what’s needed from optics and lasers
Daniel Holder is a research associate for laser material processing at the University of Stuttgart's IFSW.
Daniel Holder, of the IFSW at the University of Stuttgart, shares how new USP laser technologies could facilitate the rapid micromachining of silicon wafers
