US manufacturer SLD Laser has launched the first white light chip with a switching function
Hamamatsu Photonics has developed a system for high-speed inspection of micro-LEDs on wafers
ProPhotonix has extended its range of Prodigii digital laser modules with five new wavelengths: 375nm, 405nm, 450nm, 905nm and 940nm
Ocean Optics has developed a range of high-powered LED light sources for fluorescence excitation and other spectroscopy measurements
Opto Diode has introduced the fourth device in the UVC series of narrow-spectral-output ultraviolet light-emitting diodes (UVLEDs)
Heraeus Noblelight has released FiberLight L3, a broadband UV LED light source module for analytical measurement instruments combing the benefits of LED technology with broadband UV spectral output
PureLiFi has provided its LiFi technology for a new range of LiFi-integrated lighting products
Dymax Corporation has introduced the BlueWave MX-Series Multichannel Controller, an LED controller that allows manufacturers to power up to four emitter workstations at once
LEJ is your provider of high-performance Illumination as well as Power Electronic solutions in the fields of Microscopy, Analytics, Semiconductor, Industry and Medical Technology.
MagnaChip Semiconductor now offers a multi-channel Mini LED Driver for the rapidly growing digital signage market
Keely Portway looks at the latest advances in diamond turning, including new properties and functions for optics
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Joerg Volpp and Adrien da Silva, at the Luleå University of Technology, investigate beam shaping possibilities for high-power processing, co-authored by Alexander Laskin, from Adloptica
Carlos Lee, Epic’s director general, talks to Maria Chiara Ubaldi, co-founder and chief executive of Milan-based CareGlance
Image: Universal Quantum
Gemma Church details Universal Quantum’s work building a million-qubit quantum computer and what’s needed from optics and lasers
Daniel Holder is a research associate for laser material processing at the University of Stuttgart's IFSW.
Daniel Holder, of the IFSW at the University of Stuttgart, shares how new USP laser technologies could facilitate the rapid micromachining of silicon wafers
