CHRocodile snaps up hole measurement

Armstrong Optical and its supplier Precitec Optronik have recently investigated the measurement of blind vias in silicon wafers. The vias were produced by laser drilling and had external hole diameters of between 15 and 30µm and depths ranging from 50 to 500µm

Bookham improves customer design process

Bookham has integrated the 3D virtual-design file-sharing software, Autodesk STEP Translator for AutoCAD, into its sales process, enabling its customers to design-in its high power laser components with greater speed and efficiency.


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