Car manufacturing has been hit hard by Covid-19 but the need for vision on production lines has not diminished, as Greg Blackman finds out
Confocal Raman imaging and related techniques continue to increase in popularity. This whitepaper describes five key factors to consider when evaluating instrumentation: speed, sensitivity, resolution, modularity and upgradeability, and combinability.
CSEM has developed the world’s first fully autonomous camera that can be deployed like a sticker, opening up new possibilities for surveillance and IOT sensors
Research and innovation hub Imec has introduced a high-speed UV-sensitive time-delay-integration (TDI) imager that is based on charge-coupled-device (CCD)-in-CMOS technology
Princeton Instruments has introduced the SpectraPro HRS-750, a new 750 mm focal length spectrograph and scanning monochromator that features an astigmatismcorrected optical design, a mechanical scanning range of 0-1,500nm, as well as exceptional resolution of 0.05nm or better
An even more comprehensive quality inspection is now available in float glass production with Isra Vision’s Floatscan-5D-system – including coating inspection, detection of low-contrast optical lines and improved core-size accuracy
Keely Portway looks at the latest advances in diamond turning, including new properties and functions for optics
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Joerg Volpp and Adrien da Silva, at the Luleå University of Technology, investigate beam shaping possibilities for high-power processing, co-authored by Alexander Laskin, from Adloptica
Carlos Lee, Epic’s director general, talks to Maria Chiara Ubaldi, co-founder and chief executive of Milan-based CareGlance
Image: Universal Quantum
Gemma Church details Universal Quantum’s work building a million-qubit quantum computer and what’s needed from optics and lasers
Daniel Holder is a research associate for laser material processing at the University of Stuttgart's IFSW.
Daniel Holder, of the IFSW at the University of Stuttgart, shares how new USP laser technologies could facilitate the rapid micromachining of silicon wafers
