The space sector offers numerous oppurtunities for photonics technologies in the development and offering of satellite-based services. (Image: Shutterstock/Dima Zel)
The ongoing commercialisation of the space sector is creating numerous opportunities for photonics technologies, Matthew Dale learns
Semiconductor packaging encases integrated circuits in a protective form factor to fit into a device, allowing the chip to be connected to the circuit board. It is an essential part of semiconductor design and manufacture, yet moving from concept to full-scale packaging presents a number of challenges. Whether you’re a photonics start-up with a great idea or an established company looking to prototype a new design, this white paper outlines the challenges faced from semiconductor package design and prototyping, through process development and optimisation to ensure that your device can be manufactured with the desired throughput and quality.
Organoid imaged with Andor’s desktop confocal microscope system, the BC43. Credit: Andor
As microscopes become ever more powerful, a growing band of businesses are racing to make the latest technologies more accessible and more affordable, reports Rebecca Pool
Illustration of a three-dimensional crystal with various types of confining centres. (a) Crystal with four confining centres, each trapping waves (yellow) in all three dimensions simultaneously. (b) Crystal with a linear confining centre where waves can propagate in one dimension, analogous to an optical fibre. (c) Crystal with a planar confining centre where waves can propagate in two dimensions, analogous to a 2D electron gas. (Image: Vos et al.)
Newly discovered fundamental rules have been embedded into software to dramatically optimise the design of photonic integrated circuits
