semiconductor

Semiconductor packaging: from concept to commercialisation

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Semiconductor packaging encases integrated circuits in a protective form factor to fit into a device, allowing the chip to be connected to the circuit board. It is an essential part of semiconductor design and manufacture, yet moving from concept to full-scale packaging presents a number of challenges. Whether you’re a photonics start-up with a great idea or an established company looking to prototype a new design, this white paper outlines the challenges faced from semiconductor package design and prototyping, through process development and optimisation to ensure that your device can be manufactured with the desired throughput and quality.

Building a new semiconductor fab can cost more than €10bn. Credit: Imec

Subsidising a way out of semicon shortages

Proposed multi-billion dollar and euro packages look set to increase uptake of leading-edge lithography, including for photonic technologies, finds Andy Extance

Photonic chips can overcome the expected limit to Moore’s Law and will help tackle energy sustainability issues. (Image: PhotonDelta)

Dutch photonic chip ecosystem PhotonDelta secures €1.1bn funding

The funding will be used to invest in photonic startups and scaleups, expand production and research, attract and train talent, drive adoption, and develop a world-class design library

Innovative wafer-level optics technologies help solve a key challenge of connecting many fibers to silicon chips for datacom and telecom applications. (Image: Teramount)

EV Group and Teramount collaborate on PIC packaging technologies

The collaboration will leverage EVG's nanoimprint lithography technology, expertise and services with Teramount's PhotonicPlug technology

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