start-ups

Semiconductor packaging: from concept to commercialisation

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Semiconductor packaging encases integrated circuits in a protective form factor to fit into a device, allowing the chip to be connected to the circuit board. It is an essential part of semiconductor design and manufacture, yet moving from concept to full-scale packaging presents a number of challenges. Whether you’re a photonics start-up with a great idea or an established company looking to prototype a new design, this white paper outlines the challenges faced from semiconductor package design and prototyping, through process development and optimisation to ensure that your device can be manufactured with the desired throughput and quality.

Photonics components are being used in free-space optical communications to enable faster data transfer between satellites and ground stations. (Image: ESA)

A changing landscape in the space economy

Matthew Dale speaks with ESA to learn about the opportunities arising for photonics in the space sector

Jonas Zeuner of VitreaLab, centre, is joined onstage by Jenoptik's Song Yop Chung, left, and Ralf Kuschnereit, right. Credit: SPIE

SPIE StartUp Challenge winners announced

VitreaLab, with its laser-lit chip that enables more power-efficient displays was announced the winner of the $10,000 top prize

Pieter Klinkert, fund manager at PhotonDelta (left), Simone Cardarelli, CEO of MicroAlign (centre) and Pleuni Hooijman of Innovation Industries (right). (Image: Photon Delta)

New investment to boost integrated photonics start-up

TU Eindhoven spinoff MicroAlign is developing a new alignment solution for connecting multiple optical fibres and photonic chips

Winning investment in 2020

Following the Inpho Venture Summit in October, Blumorpho CEO, Géraldine Andrieux, discusses how startups should approach pitching for venture capital funding in these uncertain economic times

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