The Chips Joint Undertaking (Chips JU) launches PIX Europe, the EU-backed pilot line for PICs, signalling Europe’s ambitions to lead innovation and production in the growing sector, and strengthen its semiconductor sovereignty.
Hybrid photonic integrated circuits (PICs) that combine photonic components made on multiple material platforms are poised to play a pivotal role across industry, offering groundbreaking advances in speed, efficiency and scalability.
Teledyne Technologies has agreed to acquire Optical Systems and Advanced Electronic Systems from Excelitas Technologies for $710m, strengthening its position in the aerospace and defence sectors.