Semiconductor packaging encases integrated circuits in a protective form factor to fit into a device, allowing the chip to be connected to the circuit board. It is an essential part of semiconductor design and manufacture, yet moving from concept to full-scale packaging presents a number of challenges. Whether you’re a photonics start-up with a great idea or an established company looking to prototype a new design, this white paper outlines the challenges faced from semiconductor package design and prototyping, through process development and optimisation to ensure that your device can be manufactured with the desired throughput and quality.
