PIC/optical fibre connections made more efficient with microlenses
![Chip light](/sites/default/files/styles/content_banner/public/2023-12/shutterstock_2224940701.jpg?h=d41038b0&itok=FoIK0Yne)
The Belgium-based team is developing solutions to overcome the packaging and integration challenges of photonic integrated circuits for next-generation telecommunication systems
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