SPI Lasers has released its 30W Pulsed Laser, which extends the output power of the existing pulsed product range. It has a typical M2 of 3.2 giving a more uniform flatter power distribution over the beam. Applications include: anneal marking, anodised aluminium marking, thin film patterning, plastic marking, engraving and paint removal.
The additional energy of the laser means that it's well suited for dual head marking stations giving >10W per head. The laser benefits from the flexibility in frequency range from CW to 500kHz and the characteristic waveforms, which allow user selectable pulses. An extremely flexible option for manufacturers looking to reduce maintenance costs, reduce footprint of manufacturing processes and ultimately reduce cost of ownership. A laser with flatter energy distribution enables greater and more varied materials processing. The laser offers faster processing, higher production with crisper cleaner marks and for thin film applications in particular, less risk of substrate damage.