Scanlab will introduce an integrated hybrid polygon laser scan system at Lasys in Stuttgart. This high-dynamics polygon laser scan system is especially well-suited to line-by-line processing of surfaces such as silicon wafers via high-repetition ultrashort-pulse (USP) lasers.
USP lasers are ideal for high-precision microprocessing, but to achieve industry-suitable productivity, the USP laser must be used with a fast scanner capable of positioning the individual laser pulses onto a workpiece without pulse overlaps.
Scanlab’s hybrid polygon scanner combines the speed of polygon scanners with the high precision of galvanometers. Two galvanometer scan axes correct typical deviations and imperfections in polygon wheel symmetry to achieve the flexibility necessary for pixel-accurate processing. The system has a large working distance and provides straightforward integration of the mechanical feed axis and short process times.
Scanlab, Innolas Systems and the Institute for Solar Energy Research Hameln (ISFH) jointly tested laser processing of crystalline silicon solar cells. The scan system reduced the processing time of full-surface back-side structuring of a six-inch wafer from nearly a minute to less than 5 seconds.
This technology is also suitable for mobile devices, the electronics industry and processing composites.