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Photonics West set to attract more than 17,000 visitors

Visitors to the SPIE Photonics West event in San Jose, USA can expect a bigger show than ever before, with 1,164 exhibitors and 3,100 technical presentations.

Event organisers expect more than 17,000 researchers and applications engineers to attend the event, which runs from 19-24 January 2008. The presentations will take the form of four symposia, covering the biomedical applications of photonics (BiOS 2008), laser research (Lase 2008), micro electromechanical systems (MOEMS-MEMS 2008) and optoelectronic technologies (Opto 2008).

‘The BiOS topics always generate a lot of interest,’ Amy Nelson, a spokesperson for the exhibition, told electrooptics.com. ‘The applications discussed range from early-stage cancer detection to neural stimulation using optics.’ Other topics include the therapeutic applications of light for heart disease, the use of lasers in dentistry and biomedical imaging.'

The conferences on lasers and applications will include sessions on laser-based micro- and nano-packaging for energy devices, new displays and lighting, and ultrafast lasers in cell biology and imaging. Wide band-gap (UV) lasers, LEDs, and photovoltaics will also be hot topics in sessions that cover the latest developments in integrated optoelectronic devices.

Two exhibitions will run alongside the symposia. The Biomedical Optics (BiOS) exhibition will run from 19-20 January with 156 stands, and 1,009 companies will be showcasing their products at the Photonics West exhibition, which runs from 22-24 January. Both exhibitions are open to visitors at no charge.

The BiOS exhibition will include components, products, instrumentation, and applications in molecular imaging, therapeutic lasers, nano-biophotonics, biosensors, and spectroscopic and microscopic imaging. The Photonics West exhibition will demonstrate the latest developments in nanotechnology, optics, lasers (solid state, gas, fibre, diode, and crystal), LEDs, photonic packaging, MEMS/MOEMS components and applications, communication devices and materials, optoelectronic components, and imaging technologies.

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