300mm silicon photonics targets AI interconnects after CEA-Leti and NcodiN partner up
The collaboration between CEA-Leti and NcodiN involves bonding III-V semiconductor dies to 300mm wafers using direct bonding and high-precision alignment (Image: AUBERT/CEA)
The collaboration aims to scale nanolaser-based optical interposers on 300mm wafers for AI data links
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