Smart Photonics moves to 4-inch wafers to scale up photonic chip production

4-inch wafers processed within the OIP4NWE project (Image: OIP4NWE)

The doubling of production rate translates into a lower price per chip, accelerating commercial roll out and helping to meet demand for photonic integrated circuits

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TSMC looks to boost photonics integration with Ansys, Synopsys and Cadence partnerships

Ansys and TSMC will collaborate on a silicon photonics integration system and co-packaged optics platform. Synopsys will support Nvidia’s computational lithography platform, while Cadence will advance system and semiconductor design.

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