Electronics specialist Mosis has teamed up with nanoelectronics firm Imec, the Tyndall National Institute and ePIXfab, the European silicon photonics support centre. The partnership gives Mosis' customers access to imec’s fully integrated silicon photonics processes and Tyndall’s silicon photonics packaging technology.
Imec’s silicon photonics platform enables R&D of silicon photonic integrated circuits for high-performance optical transceivers (25Gb/s and above) for telecom, datacom, and optical sensing for life science applications. The offered integrated components include low-loss waveguides, efficient grating couplers, high-speed silicon electro-optic modulators and high-speed germanium waveguide photo-detectors.
A design kit to access Imec technologies will be provided. Moreover, the Tyndall National Institute, being a partner of ePIXfab, offers the ability to provide packaged silicon photonics devices. This includes the design and fabrication of custom photonic packages, fibre coupling (single and arrays) and electrical interconnects. Designs rules to support these packaging capabilities will also be provided.
'Companies can benefit from Imec silicon photonics capability through established standard cells, or explore the functionality of their own designs in multi-project wafer runs,' said Philippe Absil, programme director at Imec.