PRESS RELEASE

ES-CUT150 compact laser profiling system

ES Technology has released the ES-CUT150 thin-sheet laser profiling system, designed to meet the requirements for production of a broad range of medical device components.

The system is said to be compact, high-precision, and competitively priced. It has been designed for use with the wide range of metals typically used in the production of medical device components, including stainless steels, titanium, aluminium, gold, silver and brass. The pulsed YAG laser is capable of cutting material up to 5.0mm thick, and can be configured to produce a cut width of only 18µm, enabling high precision cutting and profiling with minimal burr formation.

The material to be processed is manipulated under the fixed laser optics by a Baldor brushless-servo driven X-Y table, which has a 400 x 400mm work envelope. With an accuracy of +/-10µm and speeds of up to 35.0mm/second, the system can cut and profile high quality components at high speeds. A micrometer adjustment facility allows the processing head to be set to the optimum height for the material thickness being cut at the time, and appropriate air assist gasses can be introduced via attachments to the processing head. Additional options such as a honeycomb mounting base and extraction unit, are also available to remove any fine dust created during cutting.

The ES-CUT150 system is configured as a fully integrated standalone machine with a Class 1 enclosure, allowing safe operation at all times. The system can be quickly set up by importing CAD data of the part to be produced, and the machine software will accept common CAD formats such as DXF. ES has also developed a bespoke operator interface for the PC-based control system, enabling intuitive machine setting and operation.

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