PRESS RELEASE

eTEC

Nextreme has developed an advanced thin film embedded thermoelectric cooler (eTEC) which aims to address the thermal management needs of the electronics, photonics, biotechnology and aerospace industries. Functioning as a miniature, solid-state heat pump, the eTEC can be used to cool hot spots resulting from localised areas of high heat flux on an IC. The nano-structured device is manufactured using semiconductor processing techniques. The eTEC pumps heat from low thermal conductivity materials to a high thermal conductivity material, thereby cooling the hot spots. This cooling increases product performance while reducing system costs.

The eTEC has a fast response time for rapid cooling and heating to maintain a precise temperature depending on the needs of the application. The device pumps a maximum heat flux of 150 W/cm2 with some designs delivering as much as 400 W/cm2. In a high Coefficient of Performance system, Nextreme’s eTECs can still pump a heat flux of 50-100 W/cm2.

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