Techspec Fused Silica Wafers

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Edmund Optics has introduced new Techspec Fused Silica Wafers. These versatile wafers are thin, circular pieces of UV fused silica designed to be used as test substrates to measure the quality of optical coatings. Fused Silica Wafers are also outstanding for use as dummy components for set-up processes, as well as for semiconductor microlithography or for micro-electronic-optical applications (MEMS).  

The wafers exhibit less than 10Å Surface Roughness with a surface quality of 40-20. Each Fused Silica Wafer has been ultrasonically cleaned and is delivered in contaminant-free packaging to ensure highest quality.

The wafers are available in 100mm, 200mm and 300mm diameter sizes. RoHS compliant, all have thicknesses of 1.00mm and a transmission range of 0.2-2.2μm. Fused Silica Wafers are in-stock and available for immediate delivery for fast turnaround and excellent value.