EPIC's focus on integrated technologies packaging
EPIC organises a Photonic Integration and Packaging meeting at Fraunhofer IZM in Berlin, Germany (Image: EPIC)
The European Photonics Industry Consortium (EPIC) recently engaged with two events related to integrated photonics packaging.
EPIC organised a technology meeting on Photonic Integration and Packaging, and moderated the Co-Packaged Optics session at the SEMI 3D Systems & Summit. Packaging of integrated photonics involves enclosing and protecting photonic integrated circuits (PICs) to ensure their functionality, reliability, and durability.
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