Tyndall's photonics packaging group partners with MIT on sustainable semiconductors
![The project aims to advance sustainable semiconductor chips production processes and workforce education programmes (Image: Tyndall) The project aims to advance sustainable semiconductor chips production processes and workforce education programmes (Image: Tyndall)](/sites/default/files/styles/content_banner/public/2024-05/Screen%20Shot%202024-05-01%20at%2012.29.17.png?h=9aed74ef&itok=T8ryUuC2)
The project aims to advance sustainable semiconductor chips production processes and workforce education programmes (Image: Tyndall)
FUTUR-IC is a reference to the future of integrated circuits, or chips, through a global alliance for sustainable microchip manufacturing.
Welcome to Electro Optics
Already registered? Sign in to continue reading
Not got an account? Register for free to continue reading