Tyndall's photonics packaging group partners with MIT on sustainable semiconductors | Electro Optics

Tyndall's photonics packaging group partners with MIT on sustainable semiconductors

The project aims to advance sustainable semiconductor chips production processes and workforce education programmes (Image: Tyndall)

The project aims to advance sustainable semiconductor chips production processes and workforce education programmes (Image: Tyndall)

FUTUR-IC is a reference to the future of integrated circuits, or chips, through a global alliance for sustainable microchip manufacturing.

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A microlens array with commercial-level optical quality, 3D-printed using the blurred tomography method

Researchers use blurred light to 3D print optical components

Researchers from the National Research Council of Canada have developed a 3D printing method that can rapidly produce commercial-level optical quality microlenses, making it faster and simpler to design and fabricate a range of optical devices.

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