3S and Finistar plot packaging plan

Share this on social media:

Optoelectronic components manufacturer 3S Photonics and optical communication components supplier Finisar have agreed to develop a new packaging platform for 980nm cooled laser pump modules.

Under this agreement, 3S Photonics will be the exclusive supplier of the 980nm laser chips used for this platform, and Finisar will implement a manufacturing line based on this platform in its newly expanded facilities in Wuxi, China.

Finisar will use these 980nm pump modules in their industry-leading EDFA and Line Card products for the telecom market. 3S Photonics will use the packaging platform to serve its own customers.

Alexandre Krivine, CEO of 3SPGroup, said: 'We are very pleased to launch this agreement which will allow 3S Photonics to gain access to an alternative competitive packaging platform that will improve the fixed cost absorption of our wafer fab.

'We are proud to be selected as the sole supplier by Finisar for these high power applications, which is recognition of the leading performance and reliability of our 980nm chips.'