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New Infrared Technologies (NIT) has introduced the NSC1101, a high dynamic range read out circuit (ROIC) designed to interface with any photodiode array, through flip chip bonding. NSC1101 is in VGA format (640 x 512 pixels), it has a pitch of 15µm and can accept any PDA with p-on-n or n-on-p.

Thanks to its native wide dynamic range of more than 120dB the sensor does not require any setting or exposure time control.

NSC1101 can be used with all infrared sensing materials such as InSb, InGaAs or HgCdTe and can operate at cryogenic temperature of 80K. Other photo sensing materials, such as AsGa for THz or X-ray detection have been already sucessfully used.

NSC1101 is a sampling stage and can be ordered from NIT in an 8-inch wafer form.