Taking the heat off PICs
28 March 2018
Shrinking optoelectronic components and combining them with silicon devices requires careful consideration of thermal management, finds Andy Extance
Shrinking optoelectronic components and combining them with silicon devices requires careful consideration of thermal management, finds Andy Extance
Matthew Dale discovers how scaling spectrometers down to the chip level enables them to be mass-produced in standard MEMS foundries, making spectroscopy more affordable for various new applications