The Lasers and Material Processing division of Jenoptik has sold its thermal laser separation technology to 3D-Micromac.
Jenoptik has sold patents, know-how and development results in the field of thermal laser separation (TLS-Dicing). The technology is used for various applications, such as the separation of microchips in semiconductor manufacturing.
The transfer enables 3D-Micromac, based in Chemnitz, Germany, to broaden its portfolio of laser systems in the field of semiconductor technology and also to directly market this laser technology.
TLS-Dicing (thermal laser beam separation) is used in the semiconductor industry's back-end to separate semiconductor wafer in components. A laser heats up the material locally and a cooling medium cools it down immediately afterwards. The thermally induced mechanical stress leads to a complete cleaving of the wafer.
Tino Petsch, CEO of 3D-Micromac, commented: 'In the coming months, we will continue to further develop the process in co-operation with the Fraunhofer IISB and implement it in industry-ready machine technology.'
In contrast to customary separating technologies, TLS-Dicing is characterised by clean edges without microcracks and, consequentially, by higher bending strength. Process speeds of between 200 and 300mm/s are possible and normally result in the multiplication of the output while costs are reduced.
In the future, Jenoptik’s Lasers and Material Processing division will continue to focus on the 3D processing of plastics and metals, such as in the automotive industry.
Jenoptik has also appointed Dr Mario Ledig as head of the Lasers business unit within the company's Lasers and Material Processing division. In this position, he is responsible for the entire business unit on a global level. He was also appointed as managing director holding operational responsibility for Jenoptik Laser – one of the two companies within this business unit.