Rudolph Technologies has introduced the NSX Series, a highly-flexible inspection and measurement platform for process development and control of die-level interconnects. Already in use by multiple customers worldwide, the NSX Series with high-speed 3D metrology is capable of both high-volume production monitoring and advanced process development.
The new capability provides a 200-400 per cent throughput improvement over the company’s previous Wafer Scanner bump metrology system. With the increasing number of new packaging technologies being developed by foundries, outsourced assembly and test (OSAT) manufacturers, and integrated device manufacturers (IDMs), the flexibility and reliability of this new capability on the NSX Series platform is especially valuable to customers seeking to move rapidly from pilot lines to production.
Data is collected in seconds from millions of bumps and then analysed by Rudolph’s Discover Software analysis database. Engineers gain unique insight into critical metrology applications, from both an individual bump point of view or holistically as a wafer, as part of a simultaneous product and process control solution.